Introduction » Soldering » Vapour phase reflow oven VPO
The Vapor Phase One offers development engineers as well as small to medium sized prototyping service providers one of the most gentle soldering processes in the industry. In contrast to infrared or convection processes, assemblies with high thermal mass, fine pitch structures or temperature-sensitive components can be processed without any problems.
Fast temperature profiles
Allows fast temperature profiles using a height-adjustable PCB lift.
Custom soldering profiles
Import individual soldering profiles via SD card to adapt heating power and lift position to different solder pastes and PCB technologies.
Powerful fans cool the process chamber quickly after the soldering process and ensure minimal loss of Galden®.
The assembly is kept at 120 °C while cooling down so that there will be hardly any Galden® residues on the PCB.
The lid to the process chamber lifts automatically to simplify the insertion and removal of PCBs.
Lid comes with a viewing window and internal lighting that allow insights into the process chamber.
A variety of safety mechanisms are implemented in both hardware and software to ensure a secure usage and soldering process.
Dimensions: 495 x 650 x 320 mm
Power consumption: max. 1100 W
Voltage: 115 / 230 VAC (60 / 50 Hz)
Ambient temperature: +15 °C … +35 °C
Geographical altitude (above mean sea level): max. 2000 m
Weight: 22 kg
Enclosure: Stainless steel
Data Interface: SD Card
Maximum soldering area: 200 x 185 mm
Tested heat-transfer media: Galden® LS 230, XS 235 and HS 240
Volume of Galden: 500 - 1000 ml
Volume of Galdenused per cycle: 0.49 ml
Cooling: Closed water cooling system with 4x 120 mm fans
Display: 4-inch capacitive touchscreen with 800 x 480 pixels