Solder Paste Application

Solder paste application is the next step in PCB prototype production right after PCB milling. Solder paste can be applied by a stencil printer or by a pneumatic dispenser. Both methods have their distinct advantages depending on the scale and requirements of your project.

Solder Paste Application Methods

• Stencil Printing: Ideal for applying paste across multiple pads simultaneously using a stencil printer, perfect for boards with higher component density or repeated runs.
• Precision Pneumatic Dispensing: The syringe is fixed in a manipulator and controlled via a pneumatic dispenser, allowing extremely accurate paste placement onto specific soldering pads without a stencil—making it very popular in flexible prototyping.
• Manual Application: The operator holds the syringe directly by hand for quick, basic dispensing tasks and immediate fixes.