REFLOW
Reflow is the sixth and final stage of the MIPEC PCB prototyping workflow. After SMD components have been positioned on the paste-coated PCB, the assembled board passes through a controlled thermal cycle that melts the solder paste and forms the final electrical and mechanical connections.
Controlled Heating
Heat the populated PCB according to a defined thermal profile while maintaining controlled temperature conditions across the assembly.
Solder Reflow
Bring the solder paste through its reflow stage so that it wets the component terminals and PCB pads to form solder joints.
Controlled Cooling
Cool the completed assembly after reflow so the solder joints solidify and the finished PCB can proceed to inspection and testing.
What Is Reflow Soldering?
Reflow soldering is a controlled thermal process used to permanently solder surface-mount components to a printed circuit board after solder paste application and component placement.
The populated PCB follows a programmed temperature profile through heating, reflow and cooling stages. Controlling this thermal cycle helps produce repeatable solder joints while limiting unnecessary thermal stress on the PCB and its components.
Reflow follows Pick & Place and completes the physical PCB prototyping and SMT assembly workflow.
Repeatable Thermal Profiles
A programmable reflow oven gives development teams direct control over the soldering profile, allowing the thermal process to be adapted to the PCB, solder paste, component mix and assembly requirements.
Choose the reflow oven that matches your PCB size, soldering process and laboratory requirements.
Product sorting
List of products
Listing controls
Understanding the Reflow Thermal Profile
A controlled thermal profile moves the populated PCB through a sequence of temperature stages. Each stage contributes to a repeatable soldering process and helps protect the PCB and components from unnecessary thermal stress.
Preheat
The PCB and components are heated progressively rather than being exposed immediately to peak soldering temperature.
Soak
The assembly continues heating toward the required reflow conditions while temperatures across the board stabilize.
Reflow
The solder paste reaches its reflow region and forms solder joints between component terminals and PCB pads.
Cooling
The assembly is cooled after reflow so the solder joints solidify before handling and inspection.
From Populated PCB to Finished Assembly
Reflow begins after Pick & Place, when all required SMD components have been positioned on the solder paste deposits.
1. Load: Place the populated PCB into the reflow chamber.
2. Profile: Select or configure the thermal profile required for the assembly.
3. Reflow: Run the controlled heating cycle to form the solder joints.
4. Cool & Inspect: Allow the assembly to cool before visual inspection and testing.
Board Loading
Position the populated PCB inside the reflow chamber without disturbing the placed components.
Profile Selection
Select the thermal profile appropriate for the board, solder paste and component configuration.
Controlled Reflow
The oven automatically executes the programmed heating and soldering cycle.
Finished Assembly
After controlled cooling, the soldered PCB is ready for inspection, testing and further integration.
Why Use Controlled Reflow Soldering?
Repeatable Profiles
Store and reproduce controlled thermal processes for recurring PCB assemblies and development work.
Uniform Heating
Controlled chamber heating helps distribute thermal energy across the PCB during the soldering cycle.
Process Control
Adapt the thermal cycle to different PCB assemblies, solder pastes and process requirements.
Complete In-House Assembly
Finish the complete PCB prototyping and SMT assembly process directly inside your laboratory.
Where Reflow Fits Into the MIPEC Workflow
Reflow is the sixth and final stage of the complete in-house PCB prototyping workflow. It follows Pick & Place and transforms the populated PCB into a soldered assembly ready for inspection, testing and integration. Explore the complete MIPEC workflow.
Preparation
Drilling
Plating
Paste
Place
From PCB Data to a Finished Assembly
CAM & data preparation → milling & drilling → through-hole plating → solder paste → pick & place → reflow
Reflow Soldering FAQ
Build the Complete PCB Prototyping Workflow
Combine PCB preparation, milling, through-hole connection, SMT assembly and reflow into one integrated in-house prototyping process.