Reflow ovens

Reflow soldering is a process used primarily in electronics manufacturing to attach surface-mount components to printed circuit boards (PCBs). The assembled PCB is then heated in a reflow oven. The oven provides controlled heat that melts the solder paste. The heat is typically applied in a specific profile, often with multiple stages: pre-heat, soak, reflow, and cooling. After reaching the reflow temperature, the PCB is cooled, which solidifies the solder and creates a strong electrical and mechanical connection between the components and the PCB pads. Reflow soldering is favored for its efficiency, ability to create reliable joints, and suitability for automation. It's commonly used in the manufacture of smartphones, circuit boards, and many other electronic devices.