Reflow Oven HR-11 (Compact IR & Convection Soldering System)

The Reflow Oven HR-11 is a high-performance, single-chamber desktop reflow system engineered for precision SMT soldering of printed circuit boards. Combining infrared heating with forced hot-air convection, it ensures uniform temperature distribution across the entire process chamber. Equipped with an advanced touch-screen interface, motorized automatic door opening, and PC connectivity via HRWin software, the HR-11 delivers repeatable, professional-grade results ideal for R&D laboratories and small-scale production runs.

Key Features & Benefits

• IR & Convection Heating: Dual heating mechanism with forced hot-air convection ensures a uniform thermal profile and eliminates cold spots on complex boards.
• Advanced Thermal Profiling: Supports 6-segment linear and saddle profiles, plus a specialized drying profile (up to 16 hours at 150 °C). Includes 4 external thermocouples for direct board measurement.
• Automated Process Control: Features a programmable motorized door opening and automatic forced cooling fans that activate immediately after reflow to protect sensitive components.
• Integrated Vapour Extraction: Built-in exhaust system safely removes fumes from inside the chamber directly after the soldering cycle.
• PC Software Integration: Easily monitor, create, and archive heating profiles in real-time using the dedicated HRWin Windows application.

Technical Specifications