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REFLOW SOLDERING

Workflow Step 06 / 06

Reflow soldering joins SMD components to a prototype PCB using a controlled heating and cooling cycle. This final stage of in-house SMT assembly starts with a checked, populated board and ends with a cooled assembly ready for solder-joint inspection and electrical testing.

Prepare These Inputs

  • A populated PCB released after placement checks.
  • Solder paste recommendations and the applicable PCB and component thermal limits.
  • An oven that fits the assembly and a suitable, reviewed process profile.

Target Output

A cooled, soldered assembly with its process conditions recorded, ready for solder-joint inspection and electrical testing.

Prepare the Thermal Process and Check the Result

  1. Confirm the Process Requirements

    Check board size, component clearance and the required atmosphere. Choose air or nitrogen according to the assembly process rather than assuming nitrogen is necessary for every PCB.

  2. Review and Verify the Profile

    Select or develop a profile using the material and component requirements. When establishing or checking the process, assess the actual PCB temperature using appropriate measurement; the oven recipe is not the same as the measured board temperature.

  3. Run the Cycle and Cool

    Load the PCB without disturbing components, run the selected process and allow the assembly to cool before handling and inspection.

  4. Inspect and Hand Over for Testing

    Inspect for solder bridges, displaced parts and other visible joint or assembly defects. Follow the prototype test plan for continuity, shorts and subsequent electrical checks.

Handover to Inspection and Testing

  • The assembly and recorded thermal process correspond to the intended board and materials.
  • The PCB has cooled sufficiently for the specified handling and inspection procedure.
  • Visible defects and electrical-test results are recorded and resolved before the prototype is released for its intended use.

A changed PCB, component population or solder paste can change thermal behaviour. Review the process when these inputs change instead of copying one recipe to every assembly.

Equipment for This Stage

Detailed Guides in the Knowledge Base

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