COMPONENT PLACEMENT
Manual SMD component placement turns a paste-coated prototype PCB into a populated board ready for reflow soldering. In laboratory PCB assembly, check component identity, reference position and orientation as you work, then inspect the complete assembly before heating.
Prepare These Inputs
- A PCB with inspected solder paste deposits.
- A matching bill of materials and assembly drawing with orientation information.
- Identified components, appropriate holders and a prepared placement workstation.
Target Output
A populated PCB with component identity, orientation, position and completeness checked; the components are not yet soldered.
Place Against the Assembly Data
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Organize and Identify Parts
Match the bill of materials to the PCB revision. Label component sources and arrange tapes, tubes or other holders so similar-looking parts remain distinguishable.
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Prepare Pickup and Viewing
Set up board support, component pickup and visual assistance for the parts being handled. Confirm suitable handling before starting a placement sequence.
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Place by Reference and Orientation
Select the correct part, check its reference location and polarity or pin-one marking, then align and lower it onto the intended paste deposits.
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Review the Populated Board
Compare the assembly with the drawing and bill of materials. Check for missing parts, wrong values or types, incorrect orientation and displaced components before reflow.
Release the Assembly for Reflow When
- Component identities and populated reference locations match the assembly data.
- Polarity and pin-one orientation have been checked where applicable.
- Parts are positioned on their intended pads and the paste deposits have not been visibly displaced or bridged.
Resolve placement errors before heating the assembly. Reflow self-alignment should not be relied on to correct an unverified component position or orientation.