REFLOW OVENS
Complete the PCB Assembly with Controlled Reflow
Choose a programmable oven by PCB size and soldering atmosphere. Use controlled thermal profiles for in-house SMT prototyping and laboratory assembly.
Product sorting
List of products
Listing controls
Choose the Right PCB Format and Atmosphere
Start with maximum PCB dimensions, the required soldering atmosphere and available power supply. Check component clearance and profile-control functions in the selected oven's specifications.
| Specification | HR-11 | HR-11-N2 | HR-30 |
|---|---|---|---|
| Max. PCB size | 300 × 200 mm | 300 × 200 mm | 600 × 410 mm |
| Soldering atmosphere | Standard-air reflow | Selectable air or nitrogen atmosphere | Selectable air or nitrogen atmosphere |
| Power supply | 240 V, 50 Hz | 240 V, 50 Hz | 3 × 400 V, 50 Hz |
On smaller screens, scroll the table sideways to compare all three ovens.
Air or Nitrogen?
Nitrogen can reduce oxidation during soldering, but is not required for every PCB assembly. Nitrogen operation requires an external supply.
Read our guide to nitrogen reflow soldering when deciding which atmosphere suits your process.
Understanding the Reflow Thermal Profile
Load the populated PCB without disturbing the placed components. Select a thermal profile matched to the solder paste, PCB construction and component requirements. A typical profile includes the following stages.
Preheat
Heat the PCB and components progressively toward the required process temperatures.
Soak
Allow assembly temperatures to stabilize as required by the selected profile.
Reflow
Melt the solder alloy to form joints between component terminals and PCB pads.
Cooling
Cool the assembly so the solder joints solidify before handling and inspection.
For profile selection and practical process considerations, read our guide to reflow soldering and thermal profiles.
From Component Placement to a Soldered Assembly
Reflow follows SMD component placement. After soldering and cooling, the assembled PCB can proceed to inspection, electrical testing and integration. Explore the complete MIPEC workflow →
Soldering
Discuss Your Reflow Requirements
Tell us your PCB format, preferred atmosphere and laboratory requirements. We can help select the oven and supporting PCB assembly equipment.