REFLOW
Complete the PCB Assembly with Controlled Reflow
Reflow soldering is the sixth and final stage of the MIPEC PCB prototyping workflow. After SMD components have been positioned on the paste-coated PCB, the populated board passes through a controlled thermal cycle that melts the solder paste and forms the final solder joints.
Controlled Heating
Heat the populated PCB according to a defined thermal profile and progressively bring the assembly toward the required soldering conditions.
Solder Reflow
Bring the solder paste through its reflow region so that solder joints form between component terminals and PCB pads.
Controlled Cooling
Cool the assembly after reflow so the solder joints solidify before inspection, testing and further handling.
What Is Reflow Soldering?
Reflow soldering is a controlled thermal process used to solder surface-mount components to a printed circuit board after solder paste application and component placement.
The populated PCB follows a programmed temperature profile through heating, reflow and cooling stages. The appropriate profile depends on the PCB, solder paste, component mix and assembly requirements.
Reflow follows Component Placement and completes the physical PCB prototyping and SMT assembly workflow.
Programmable Thermal Profiles
A programmable reflow oven allows the thermal process to be adapted to the PCB, solder paste, component configuration and assembly requirements used in the laboratory.
Choose the Reflow System for Your Assembly Requirements
Select the oven configuration according to PCB dimensions, required atmosphere, thermal process and laboratory capacity.
Product sorting
List of products
Listing controls
Understanding the Reflow Thermal Profile
A controlled thermal profile moves the populated PCB through a sequence of temperature stages. The selected profile depends on the solder paste, PCB construction, component configuration and process requirements.
Preheat
The PCB and components are heated progressively toward the required process temperatures.
Soak
The assembly continues heating while temperatures across the PCB move toward the required reflow conditions.
Reflow
The solder paste reaches its reflow region and solder joints form between the component terminals and PCB pads.
Cooling
The assembly is cooled so the solder joints solidify before handling and inspection.
From Populated PCB to Finished Assembly
Reflow begins after Component Placement, when the required SMD components have been positioned on the solder paste deposits.
1. Load: Place the populated PCB into the reflow chamber.
2. Profile: Select the thermal profile for the assembly.
3. Reflow: Run the programmed heating cycle.
4. Cool & Inspect: Allow the assembly to cool before inspection and testing.
Board Loading
Position the populated PCB inside the reflow chamber without disturbing the placed components.
Profile Selection
Select the thermal profile appropriate for the PCB, solder paste and component configuration.
Controlled Reflow
The oven executes the programmed heating and soldering cycle.
Finished Assembly
After cooling, the soldered PCB is ready for inspection, testing and further integration.
Why Use Controlled Reflow Soldering?
Programmable Profiles
Store and reproduce thermal processes for recurring PCB assemblies and development work.
Controlled Heating
Manage the heating cycle across the PCB during the soldering process.
Process Flexibility
Adapt the thermal profile to different PCB assemblies, solder pastes and process requirements.
Complete In-House Assembly
Finish the PCB prototyping and SMT assembly process within the same laboratory workflow.
Where Reflow Soldering Fits Into the MIPEC Workflow
Reflow soldering is the sixth and final stage of the complete in-house PCB prototyping workflow. It follows Component Placement and converts the populated PCB into a soldered assembly ready for inspection, testing and integration. Explore the complete MIPEC workflow →
Preparation
Drilling
Connection
Application
Placement
Soldering
From PCB Data to a Finished Assembly
Project preparation → milling & drilling → through-hole connection → solder paste application → component placement → reflow soldering
Reflow Soldering FAQ
Build the Complete PCB Prototyping Workflow
Combine project preparation, PCB milling, through-hole connection, solder paste application, component placement and reflow into one connected in-house prototyping process.