COMPONENT PLACEMENT
Position SMD Components on the Prepared PCB
Component placement is the fifth stage of the MIPEC PCB prototyping workflow. After solder paste has been applied, surface-mount components are picked, aligned and positioned onto the prepared PCB before the populated board continues to reflow soldering.
Component Pickup
Pick SMD components from tapes, tubes or other component sources using controlled vacuum handling.
Vision-Assisted Alignment
Use magnified visual assistance to check component orientation and align small or fine-pitch components with the PCB footprint.
Controlled Placement
Position the component onto the solder paste while maintaining direct operator control over the placement movement.
What Is Component Placement?
Component placement is the assembly stage in which surface-mount components are transferred from their packaging and positioned onto the corresponding pads and footprints of a printed circuit board.
For prototype development and small-batch assembly, a manual vision-assisted workstation provides direct operator control together with vacuum pickup and magnified visual alignment.
The process follows Solder Paste Application and prepares the populated PCB for the final Reflow Soldering stage.
Vision-Assisted Manual Placement
Magnified visual feedback supports component orientation and alignment while the operator retains direct control of component pickup and placement — useful for prototypes and frequently changing PCB designs.
Component Placement Equipment & Accessories
Choose the placement workstation, feeder blocks and component handling accessories that match the packaging formats and assembly requirements used in your laboratory.
Product sorting
List of products
Listing controls
Pick
Select and lift the required SMD component from its feeder, tape or tube using the vacuum placement tool.
Align
Use magnified visual assistance to check component orientation and align the terminals with the PCB footprint.
Place
Lower the component onto the solder paste and release it in the required position before reflow soldering.
From Paste-Coated PCB to Populated Board
Component placement begins after Solder Paste Application. The objective is to position the required SMD components onto their corresponding PCB footprints without disturbing the deposited paste.
1. Prepare: Position the PCB and organize the components required for assembly.
2. Pick: Lift the selected component using the vacuum placement tool.
3. Align: Check component orientation and footprint alignment using magnified visual assistance.
4. Place: Lower and release the component onto the solder paste.
PCB Setup
Secure the PCB and prepare the components required for the assembly sequence.
Component Pickup
Pick individual SMD components using controlled vacuum handling.
Vision-Assisted Alignment
Magnify the working area and align the component with the PCB footprint.
Placement Complete
Position the component onto the solder paste and prepare the populated PCB for reflow.
Why Use Vision-Assisted Component Placement?
Visual Alignment
Magnified visual feedback helps the operator check orientation and align small components with PCB footprints.
Prototype Flexibility
Change components, PCB layouts and assembly sequences without programming a complete automated SMT line.
Controlled Handling
Mechanical movement and vacuum pickup assist repetitive component handling during prototype assembly.
Integrated Workflow
Continue directly from solder paste application through component placement and into reflow soldering.
Flexible Component Handling
A laboratory component-placement workstation must adapt to different packaging formats and frequently changing prototype designs. Modular accessories keep components organized and accessible during assembly.
Tape Components
Tape feeder blocks provide organized access to components supplied in standard SMD carrier tapes.
IC Tubes
Stick feeder blocks support components supplied in standard IC tubes and keep them positioned for pickup.
Modular Workstation
Feeder blocks and component holders can be arranged around the workstation according to the current PCB assembly task.
Where Component Placement Fits Into the MIPEC Workflow
Component placement is the fifth stage of the complete in-house PCB prototyping workflow. Components are positioned after Solder Paste Application and the populated PCB then continues to Reflow Soldering. Explore the complete MIPEC workflow →
Preparation
Drilling
Connection
Application
Placement
Soldering
Component Placement FAQ
Complete the PCB Assembly Workflow
Once the components are positioned, the populated PCB is ready for the final reflow soldering stage.