MANUAL PICK & PLACE SYSTEMS

Position SMD Components on the Prepared PCB

Combine vacuum pickup and visual assistance with direct operator control for in-house SMT prototyping and small-batch PCB assembly.

Product sorting

List of products

P2J 4P VIS

350 × 210 mm PCB area · Vacuum pickup · 8 Mpix vision system · 15.6" monitor · Optional feeders & dispensing

040
FDS 08

For MIPEC 4PLACE · 5 × SO8 or 5 × SO16 variant · IC stick feeding · Modular workstation accessory

041-1
FDT 108

For MIPEC 4PLACE · 10 × 8 mm or mixed-width variant · Tape-fed SMD components · Modular workstation accessory

042-1

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3 items total

Configure Your 4PLACE Workstation

The 4PLACE is the placement workstation. Add tape or stick feeder blocks to organize components according to their packaging and the current assembly task.

4PLACE Workstation →

Vision-assisted manual placement with vacuum component pickup and direct operator control.

Tape Feeder Blocks →

Organize SMD components supplied in carrier tapes and keep them accessible for pickup.

Stick / IC Tube Feeders →

Hold components supplied in IC tubes in a convenient position for manual pickup.

Match the setup to your components: select feeder blocks for the packaging format and tape width, then arrange them around the workstation. For specific component sizes and handling requirements, contact MIPEC.

Pick, Align and Place

Secure the paste-coated PCB and organize the required components before starting placement.

01

Pick

Lift the required SMD component from its feeder, tape or tube using the vacuum placement tool.

02

Align

Use magnified visual assistance to check orientation and align the component terminals with the PCB footprint.

03

Place

Lower and release the component onto the solder paste, then check its position before reflow soldering.

Manual control supports frequently changing PCB designs without programming an automated placement sequence. Read our guide to manual SMD component placement for practical workflow details.

Continue Your PCB Assembly Workflow

Component placement follows solder paste application and prepares the populated PCB for reflow soldering. Explore the complete MIPEC workflow →

Workflow Step 06

Next Step: Reflow Soldering

Heat the populated PCB using a suitable thermal profile to form the solder joints.

Explore Reflow Ovens →