SOLDER PASTE APPLICATION
Solder paste application prepares a prototype PCB for surface-mount assembly. In an in-house SMT prototyping workflow, paste is applied by stencil printing or controlled dispensing. Check the board revision, pad coverage and deposit alignment before placing SMD components.
Prepare These Inputs
- An inspected PCB with any required layer connections completed.
- The correct assembly revision and a defined solder paste pattern.
- Suitable solder paste and a prepared stencil-printing or dispensing setup.
Target Output
A paste-coated PCB with the intended pads covered and the deposits checked, ready for SMD component placement.
Apply Paste and Inspect Before Placement
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Confirm the Assembly Side
Check the PCB revision, mounting side and intended paste locations. Select the application method for the layout and prototype quantity.
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Prepare Material and Equipment
Follow the solder paste handling instructions. Set up the stencil and board support, or select suitable dispensing material, tip and process settings.
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Check the First Application
Check stencil alignment or dispensing deposits before repeating the operation across the board. Confirm that the selected setup gives suitable deposits for the intended pads.
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Review the Completed Pattern
Inspect for missing paste, offset deposits, excess material and bridging. Correct the application before beginning component placement.
Ready for SMD Placement When
- The paste pattern matches the intended board side and assembly revision.
- Deposits are positioned on the intended pads without visible bridging.
- Paste handling and working-time requirements remain suitable for the planned placement operation.
Move the board to placement without disturbing the deposits. If assembly is delayed or the paste pattern is damaged, reassess the deposits and material condition before continuing.