Large Reflow Oven HR-30 (Extra-Large Chamber SMT Soldering & Nitrogen System)

Extra-large chamber (up to 600 mm) · Halogen & convection heating · Integrated nitrogen (N2) support · Touch screen with 99 profiles

Description

Product detailed description

The Large Reflow Oven HR-30 is a high-capacity, drawer-type reflow system engineered specifically for production and prototyping of larger circuit boards, including up to 600 mm long LED boards. Featuring an extra-large process chamber equipped with 10 halogen heaters and dual dark heating radiators, it ensures rapid temperature ramps and exceptionally uniform heat distribution even across complex assemblies. With integrated nitrogen (N2) supply management for oxidation-free soldering, dual-stage fume extraction, and intuitive touch-screen controls, the HR-30 delivers industrial-grade reliability for demanding small-series manufacturing.

Key Features & Benefits

Extra-Large Process Chamber: Specially designed workspace accommodating oversized PCBs and long LED strips up to 600 mm in length.
High-Performance Heating: Combines 10 halogen heaters for rapid temperature increase with dark heating radiators and internal fans to eliminate thermal shadows and ensure perfect lead-free soldering.
Integrated Nitrogen (N2) Atmosphere: Automated N2 supply control maintains 98–99% purity inside the chamber during reflow for flawless, oxidation-free joints.
Advanced Fume Extraction: Dual extraction system featuring above-door exhaust during processing and chamber evacuation immediately after reflow.
Precise Process Control & Software: Program up to 99 profiles (linear, saddle, or drying up to 16 hours) using the front touch display or HRWin PC software via USB 2.0.

Technical Specifications

Heating Technology	10x Halogen heaters + 2x Dark heating radiators with convection fans
Soldering Atmosphere	Standard Air or Controlled Nitrogen (N2) inert blanket (98–99% purity)
Nitrogen (N2) Parameters	Consumption: avg. 560 l/h, max. 1200 l/h \| Pressure: 2 – 6 bar
Max Dimensions of PCB	600 x 410 mm (Extra-large chamber)
Max Component Height	Top side: 55 mm \| Bottom side: 30 mm
Temperature Range	50 °C – 260 °C (Preheating up to 200 °C, Drying up to 150 °C)
Power Supply & Consumption	Three-phase, 3 x 400 V, 50 Hz \| Max. 7800 W (Average: 3500 W)
Control & Interface	Touch-screen LCD, physical buttons, PC USB 2.0 / HRWin software (99 program memories)
Dimensions & Weight	896 x 545 x 420 mm \| Max. 47 kg