Reflow Oven HR-11-N2 (Compact Inert Nitrogen Soldering System)

The Reflow Oven HR-11-N2 is an advanced desktop reflow system specifically engineered with an integrated nitrogen (N2) connection for inert atmosphere soldering. By maintaining a nitrogen blanket during the thermal cycle, the oven effectively suppresses oxidation, resulting in superior paste wetting, brilliant solder joints, and flawless execution for demanding fine-pitch and high-reliability SMT applications. Combining infrared heating with forced hot-air convection, an intuitive touch-screen interface, and automated process control, the HR-11-N2 brings production-grade quality directly to your laboratory or cleanroom.

Key Features & Benefits

• Nitrogen (N2) Blanket & Oxidation-Free Soldering: Dedicated N2 inlet and optimized chamber sealing allow for an inert atmosphere, eliminating oxidation, improving wetting on difficult finishes, and preventing bridging on fine-pitch components.
• IR & Convection Heating: Dual heating mechanism with forced hot-air convection ensures a perfectly uniform temperature profile across the entire workspace.
• Advanced Thermal Profiling: Supports 6-segment linear and saddle profiles, plus a specialized drying profile (up to 16 hours at 150 °C). Includes 4 external thermocouples for precise direct board measurement.
• Automated Process Control: Features a programmable motorized door opening and automatic forced cooling fans that activate immediately after reflow to protect sensitive semiconductors.
• PC Software Integration: Monitor, create, and archive heating profiles in real-time using the dedicated HRWin Windows application via USB 2.0.

Technical Specifications