Reflow Oven HR-11-N2 (Compact Inert Nitrogen Soldering System)
PCB up to 300 × 200 mm · Air or N2 atmosphere · IR + forced convection · 4 external thermocouples
Product detailed description
Compact batch reflow with selectable standard-air or controlled nitrogen atmosphere for PCB prototyping and small-series SMT assembly.
The MIPEC HR-11-N2 combines infrared heating and forced hot-air convection with an integrated nitrogen connection for reflow in a reduced-oxygen atmosphere.
The oven can operate in standard air or with a nitrogen blanket, allowing the process atmosphere to be selected according to the solder paste, PCB finish and assembly requirements.
Reflow in Air or Nitrogen
The HR-11-N2 extends the compact HR-11 platform with support for a controlled nitrogen atmosphere.
Standard air can be used for conventional reflow processes. When nitrogen is supplied, the reduced-oxygen atmosphere can limit oxidation during the thermal cycle and improve wetting conditions for applications where an inert process is useful.
Nitrogen is therefore a process option rather than a requirement for every PCB assembly.
Integrated N2 Support
Connect an external nitrogen supply and use the HR-11-N2 for controlled-atmosphere reflow without changing to a separate soldering system.
Key Features
Nitrogen Process Parameters
The HR-11-N2 includes a dedicated nitrogen connection and chamber configuration for operation with an external N2 supply.
The specified nitrogen supply pressure is 2–6 bar. Average consumption is approximately 560 l/h, with a specified maximum of 1200 l/h.
N2 Supply
Pressure: 2–6 bar
Average consumption: 560 l/h
Maximum consumption: 1200 l/h
Thermal Profiling on the PCB
Four external thermocouple inputs allow temperature to be measured directly at selected locations on the PCB during the reflow cycle.
This helps evaluate the real thermal response of the assembly rather than relying only on the programmed chamber temperature.
Programmable Profiles
The oven supports six-segment linear and saddle profiles together with an extended drying profile up to 16 hours at 150 °C.
Automatic Process Control
After the heating cycle, the motorized door can open automatically and forced cooling fans support the cooling stage.
The touch-screen interface provides local process control, while USB connectivity and HRWin software support profile creation, monitoring and archiving from a Windows PC.
Same Compact PCB Format
The HR-11-N2 processes PCBs up to 300 × 200 mm while adding nitrogen capability to the compact HR-11 platform.
Technical Specifications
| Product type | Compact air / nitrogen batch reflow oven |
|---|---|
| Heating technology | Infrared (IR) + forced hot-air convection |
| Process atmosphere | Standard air or nitrogen (N2) |
| Nitrogen pressure | 2–6 bar |
| Nitrogen consumption | Average 560 l/h · Maximum 1200 l/h |
| Maximum PCB dimensions | 300 × 200 mm |
| Grid tray dimensions | 350 × 220 mm |
| Maximum component height | Top: 50 mm · Bottom: 30 mm |
| Temperature range | 50–260 °C |
| Thermocouples | 4 external thermocouple inputs |
| Profiles | 6-segment linear / saddle profiles + drying profile |
| Drying profile | Up to 16 hours at 150 °C |
| Control | Touch-screen LCD + physical buttons |
| PC connection | USB 2.0 / HRWin software |
| Power supply | 240 V, 50 Hz |
| Maximum power | 3100 W |
| Dimensions | 510 × 370 × 340 mm |
| Weight | Max. 16 kg |
Part of the MIPEC Reflow Range
Choose the HR-11-N2 when the compact 300 × 200 mm PCB format is sufficient but your process requires the option of a controlled nitrogen atmosphere.
For standard-air reflow, the HR-11 provides the same compact PCB format without N2 support. For substantially larger PCBs, the HR-30 extends the platform to 600 × 410 mm.
When to Choose HR-11-N2
Choose this model when you need a compact reflow oven with the flexibility to run either standard-air or nitrogen-assisted soldering processes.