Pneumatic Dispensing Controller for SMD Manipulator
Analog time-pressure control · Adjustable vacuum suck-back · 10/30/50 cc adapters · Foot switch included
Product detailed description
Time-controlled pneumatic dispensing for solder paste, flux, adhesives and compatible assembly fluids.
The MIPEC pneumatic dispensing controller provides adjustable pressure and time control for syringe-based material dispensing. It can be used together with the MIPEC Dispensing Head and 4PLACE SMD manipulator for guided PCB dispensing, or independently as a benchtop dispensing unit.
The controller supports both manually triggered and timed dispensing cycles and includes adjustable vacuum suck-back to help control material flow after each dispensing pulse.
Pneumatic Time-Pressure Dispensing
The controller uses compressed air to apply pressure to material contained in a syringe or cartridge. During a dispensing cycle, a controlled pressure pulse forces material through the dispensing tip.
Pressure and dispensing time can be adjusted according to the material, dispensing tip and required application.
For solder paste dispensing, the resulting deposit also depends on solder paste formulation, particle size, tip geometry, temperature and tip position.
Time + Pressure + Material
Pneumatic dispensing is controlled by the interaction between pressure, dispensing time, tip geometry and the properties of the material being dispensed.
Key Benefits
Adjustable Vacuum Suck-Back
After a dispensing pulse ends, material can continue to move toward the dispensing tip due to pressure remaining in the syringe and the behaviour of the fluid.
Adjustable vacuum suck-back applies a small reverse pressure between dispensing cycles to help control material at the tip and reduce unwanted dripping or stringing.
The appropriate setting depends on the material being dispensed and the process conditions.
Material Flow Control Between Deposits
Vacuum suck-back helps manage material behaviour after the pressure pulse has finished, particularly with materials that tend to continue flowing from the dispensing tip.
Two Ways to Use the Controller
With the MIPEC Dispensing Head
Connect the controller to the dispensing head mounted on the MIPEC 4PLACE manipulator to create a guided PCB dispensing workstation.
The manipulator provides controlled positioning of the dispensing tip while the controller provides the pneumatic dispensing cycle.
Standalone Benchtop Dispensing
The controller can also be used independently for manual dispensing applications where the operator positions the syringe or dispensing tip directly.
The included foot switch allows the dispensing cycle to be triggered while keeping both hands available for handling the workpiece and dispensing tool.
Typical Dispensing Workflow
Prepare the Syringe
Select the appropriate syringe adapter, material and dispensing tip.
Set the Pressure
Adjust pneumatic pressure according to the material and dispensing configuration.
Set the Time
Configure the dispensing interval for the required application.
Dispense
Trigger the dispensing cycle and adjust the process according to the resulting material deposit.
Dispensing Solder Paste
Pneumatic dispensing can be a practical method for solder paste application on prototypes and low-volume PCB assemblies, particularly when paste needs to be applied selectively or PCB designs change frequently.
The process also has practical limits. Each deposit is applied individually, and very small deposits become increasingly dependent on tip geometry, solder powder particle size and material flow through the needle.
Flexible, but Process Dependent
Pneumatic dispensing provides flexibility without requiring a stencil, but deposit size and consistency depend on the complete dispensing setup rather than the controller alone.
Included Accessories
Typical Applications
Technical Overview
| Product type | Analog pneumatic dispensing controller |
|---|---|
| Dispensing principle | Time-pressure pneumatic dispensing |
| Pressure control | Adjustable |
| Dispensing time | Adjustable |
| Vacuum suck-back | Adjustable |
| Operation | Timed dispensing cycles / manual triggering |
| Syringe adapters included | 10 cc / 30 cc / 50 cc |
| Dispensing needles included | 10 pcs, various diameters |
| Foot switch | Included |
| Applications | Solder paste, fluxes, adhesives and compatible assembly fluids |
Part of the MIPEC Solder Paste Application Workflow
Pneumatic dispensing is one of the solder paste application methods available within the MIPEC PCB prototyping workflow. It can be used as an alternative to stencil printing depending on PCB design and assembly requirements.
Combine with 4PLACE
Together with the MIPEC dispensing head and 4PLACE manipulator, the controller becomes part of a guided dispensing and component placement workstation.