SOLDER PASTE APPLICATION
Solder paste application is an essential step in PCB prototype production right after board routing. Whether utilizing high-precision stencil printers or flexible pneumatic dispensers, our equipment ensures uniform and accurate paste deposition onto specific soldering pads for reliable surface-mount assembly.
Core Technologies
- Stencil Printing: Ideal for applying paste across multiple pads simultaneously using compact desktop printers, perfect for standard board layouts.
- Precision Pneumatic Dispensing: Controlled via advanced dispensers and manipulators for extremely accurate placement without a stencil.
- Process Versatility: Compatible with various types of solder pastes, gel fluxes, and adhesives for flexible laboratory prototyping.
- In-House SMT Readiness: Seamlessly bridges the gap between PCB routing and component placement in your laboratory workflow.
Product sorting
List of products
Listing controls
3 items total
Need Help Selecting the Right Solder Paste Application Equipment?
Contact our technical sales engineers for custom quotations or application guidance.